Nicholas Palmer

Title: Innovations by Nicholas Palmer

Introduction

Nicholas Palmer is an accomplished inventor based in Rutland, MA (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent. His work is recognized for enhancing the functionality and efficiency of electronic devices.

Latest Patents

Nicholas Palmer holds a patent for "Dual interposer packaging for high density interconnect." This invention discloses a method and apparatus that allows additional contact pads to be added to a package to support debug and test operations. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package includes a substrate with a matrix of conductive contact pads on both the top and bottom surfaces. The interposer features a body with a matrix of interposer contact bumps on both the inner and outer surfaces. Each interposer contact bump includes a metal coating and is designed to abut a contact pad of the semiconductor package.

Career Highlights

Nicholas Palmer is currently associated with Hewlett-Packard Development Company, L.P. His role in the company has allowed him to work on cutting-edge technologies that push the boundaries of electronic design and manufacturing. His innovative approach has led to advancements that benefit both the industry and consumers.

Collaborations

Throughout his career, Nicholas has collaborated with notable professionals, including Sharad M Shah and David Bach. These collaborations have fostered an environment of creativity and innovation, leading to the development of impactful technologies.

Conclusion

Nicholas Palmer's contributions to semiconductor packaging through his patent demonstrate his commitment to innovation in the technology sector. His work continues to influence the design and functionality of electronic devices, showcasing the importance of inventive thinking in advancing technology.