West Lafayette, IN, United States of America

Nicholas Benavides

This inventor holds 1 USPTO granted patent. Top assignee: Pc Krause and Associates, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nicholas Benavides. Retrieved from https://idiyas.com/inventor/nicholas-benavides-5mi9wzp0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Nicholas Benavides and Power Module Thermal Management

Introduction

Nicholas Benavides is an inventor associated with West Lafayette, Indiana, and Pc Krause and Associates, Inc. His patent work addresses thermal management for semiconductor power modules, where effective heat removal can help maintain reliable operation.

Latest Patents

Benavides is named on one patent, 1 patent: “Power Module Thermal Management System.” The invention describes a baseplate assembly containing a baseplate and semiconductor die, together with a fluid-based flow system. One flow path uses submerged jet impingement to direct fluid onto the semiconductor die, while a second path carries fluid in thermal contact with the baseplate. By cooling both components, the system is designed to transfer heat away from the assembly.

Career Highlights

Benavides’s listed patent reflects work on thermal control in power electronics. The design combines direct cooling of a semiconductor die with a separate cooling path for the baseplate, addressing heat removal across multiple parts of a power module.

Collaborations

Benavides is associated with Pc Krause and Associates, Inc. His listed coworkers include Jason Wells and Justin Weibel.

Conclusion

Nicholas Benavides’s patent describes a dual-path cooling approach that directs fluid to both a semiconductor die and its baseplate, highlighting his contribution to power-module thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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