Company Filing History:
Years Active: 2019-2020
Title: Nermin Mujcinovic: Innovator in Electronics Thermal Management
Introduction
Nermin Mujcinovic is a notable inventor based in Fremont, CA, who has made significant contributions to the field of electronics thermal management. With a total of 4 patents to his name, Mujcinovic has demonstrated a commitment to innovation and problem-solving in the electronics industry.
Latest Patents
One of Mujcinovic's latest inventions is the Sealable Multi-Surface Electronics Thermal Conduction Package. This innovative package is designed to house a printed circuit board assembly (PCBA) that includes microprocessors or other heat-generating elements. The unique feature of this package is its ability to elastically deform, allowing for the insertion of a complete PCBA into its interior space. Once the PCBA is in place, the package can return to its original shape, ensuring that the surfaces within the package make contact with the heat-generating elements. This design creates a conductive thermal path from the elements to the housing, effectively managing heat dissipation.
Career Highlights
Mujcinovic is currently employed at Nio USA, Inc., where he continues to develop innovative solutions in electronics. His work focuses on enhancing the efficiency and performance of electronic devices through advanced thermal management techniques.
Collaborations
Mujcinovic collaborates with Shane L. Kenyon, leveraging their combined expertise to push the boundaries of electronics innovation.
Conclusion
Nermin Mujcinovic is a prominent figure in the realm of electronics thermal management, with a strong portfolio of patents that reflect his innovative spirit. His contributions are paving the way for advancements in the efficiency of electronic devices.