Nio Usa, Inc.

Nermin Mujcinovic

Shane L Kenyon

An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly ('PCBA') with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

Sealable multi-surface electronics thermal conduction package

A compliant electronics assembly mount frame and package are provided. The compliant frame may include a number of spring features configured to flexibly maintain and/or orient an attached PCBA inside a thermal conduction package. These spring features disposed in the compliant frame may be shaped, sized, and even tuned, to bias heat generating components attached to the PCBA evenly against a thermally controlled surface of the thermal package. The frame may be made or stamped from metal, such as sheet metal, and may be formed to include one or more integral spring features.

Thermal spring frame and shield for sealed processing systems

A self-contained hinge mechanism is provided including a hinge movement control assembly. The hinge movement control assembly includes a number of stacked alternating friction rings and pressure disks providing a tunable pivoting resistance. As the hinge mechanism is actuated, an internal shaft and a set of friction rings rotationally-locked to the internal shaft and door moves relative to a set of pressure disks rotationally-locked to a fixed hinge mechanism housing and mount frame. A resistance to the pivoting of the hinge mechanism elements is provided by the clamping force of multiple force members moving the pressure disks along axial translation guides of the housing closer to one another and sandwiching the friction rings closer together.

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Fremont, CA, United States of America

Nermin Mujcinovic