Neng-Hsing Lu

Title: Neng-Hsing Lu: Innovator in Electroless Plating and Conductive Polymer Interconnects

Introduction

Neng-Hsing Lu is a notable inventor based in Berkeley Heights, NJ (US). He has made significant contributions to the fields of electroless plating and conductive polymer interconnects. With a total of 2 patents, his work has had a lasting impact on technology and materials science.

Latest Patents

One of Neng-Hsing Lu's latest patents is focused on the plasma conditioning of a substrate for electroless plating. This innovative method involves conditioning a dielectric surface for the deposition of conductive metals by exposing the substrate to a gaseous plasma derived from ammonia and/or an organic amine. This conditioning process can occur in the holes and/or on the surfaces of the substrate, enhancing the quality of the plating.

Another significant patent involves the fabrication of conductive polymer interconnect (CPI) layers. This method utilizes chains of electrically conductive particles embedded within an elastomeric matrix. The process improves contact resistance by removing a thin layer of elastomeric material that remains after standard processing. The surface layer is effectively removed through plasma etching, allowing the conductive particles to protrude at both surfaces. These protruding particles can then be plated to replace any conductive material lost during the etching process.

Career Highlights

Throughout his career, Neng-Hsing Lu has worked with several prestigious companies, including American Telephone & Telegraph Co., AT&T Bell Laboratories, and IBM. His experience in these organizations has contributed to his expertise and innovative capabilities in the field.

Collaborations

Neng-Hsing Lu has collaborated with notable individuals such as William R. Lambert and Ray D. Rust. These partnerships have likely fostered a creative environment that has led to groundbreaking advancements in his areas of expertise.

Conclusion

Neng-Hsing Lu is a distinguished inventor whose work in electroless plating and conductive polymer interconnects has paved the way for advancements in technology. His patents reflect a commitment to innovation and excellence in materials science.