Company Filing History:
Years Active: 2006-2011
Title: Nelson Troncoso: Innovator in Integrated Circuit Bonding Technologies
Introduction
Nelson Troncoso is a notable inventor based in Macungie, PA (US). He has made significant contributions to the field of integrated circuit technology, particularly in wire bonding methods. With a total of two patents to his name, Troncoso's work has advanced the performance and efficiency of integrated circuits.
Latest Patents
Troncoso's latest patents focus on methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles. These techniques allow for the formation of desired wire bond profile shapes that optimize performance. A wire is ball bonded to a first bond site in the integrated circuit using a bonding tool, and at least one bend is formed in the wire. The wire is then terminated at a second bond site with the bonding tool, creating a wire bond profile. This technique is repeated for multiple additional wire bonds within the integrated circuit, ensuring that at least two wire bond profiles are substantially perpendicular to one another at their crossing point.
Career Highlights
Nelson Troncoso is currently employed at Agere Systems Inc., where he continues to innovate in the field of integrated circuits. His work has been instrumental in enhancing the capabilities of wire bonding technologies, which are critical for the performance of modern electronic devices.
Collaborations
Troncoso collaborates with various professionals in his field, including his coworker Curtis James Miller. Their combined expertise contributes to the advancement of integrated circuit technologies.
Conclusion
Nelson Troncoso's contributions to integrated circuit bonding technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in wire bonding, paving the way for future advancements in the industry.