The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Feb. 25, 2004
Curtis James Miller, West Lawn, PA (US);
Nelson Troncoso, Macungie, PA (US);
Curtis James Miller, West Lawn, PA (US);
Nelson Troncoso, Macungie, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is terminated at a second bond site with the bonding tool, thereby creating a wire bond profile. The technique is repeated for a plurality of additional wire bonds of the integrated circuit, and at least two wire bond profiles in the integrated circuit are substantially perpendicular to one another at a crossing point of the profiles.