Greenville, SC, United States of America

Neil Wright

This inventor holds 6 USPTO granted patents and 1 EPO patent. Top assignee: Techtronic Cordless Gp. Active years: 2023-2026.


% Patents Active = 100.0


Average Co-Inventor Count = 6.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2023-2026

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6 patents (USPTO):Explore Patents

Title: Neil Wright - Innovator in Adhesive Technology

Introduction

Neil Wright is a prominent inventor based in Greenville, SC (US), known for his innovative contributions to adhesive technology. With a total of 6 patents to his name, he has made significant strides in developing practical solutions for adhesive dispensing.

Latest Patents

Among his latest inventions is the Glue Pen, which features a housing, a heater element, and a feed mechanism. The design allows for a meltable adhesive substance to be heated and dispensed efficiently. The feed mechanism includes two actuators that work in tandem to move the adhesive toward the heater element. Another notable patent is the Adhesive Dispensing System, which comprises an adhesive dispensing device and a charger base. This system includes a first light-emitting device, a handle, a power source, and a power supply interface, enhancing the user experience by providing visual feedback during operation.

Career Highlights

Neil Wright is currently employed at Techtronic Cordless Group, where he continues to innovate and develop new adhesive technologies. His work has contributed to advancements in the field, making adhesive applications more efficient and user-friendly.

Collaborations

Neil collaborates with talented coworkers, including Gabriel J Sandoval and Margarete Ostermayer, who contribute to the innovative environment at Techtronic Cordless Group.

Conclusion

Neil Wright's contributions to adhesive technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the way adhesives are utilized in various applications.

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