Paradise Valley, AZ, United States of America

Neil T Tracht


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2017

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Neil T. Tracht: Innovator in Semiconductor Technology

Introduction

Neil T. Tracht is a prominent inventor based in Paradise Valley, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of waveguide interfaces. His innovative work has led to the development of a patent that enhances the efficiency of semiconductor packaging processes.

Latest Patents

Neil T. Tracht holds a patent for an "Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound." This patent describes a method for forming circuit waveguide interfaces during a wafer-scale die packaging (WSDP) process. The embodiments outlined in the patent detail how singulated die are arranged on a wafer-like panel and covered with a molding compound that forms the bodies of the packages. The circuit waveguide interface is created within the molding compound and subsequent metallization layers, featuring an array of first conductors and a reflector interface along with an excitation element formed during metallization.

Career Highlights

Neil T. Tracht is associated with NXP USA, Inc., where he applies his expertise in semiconductor technology. His work at NXP has allowed him to collaborate with other talented professionals in the field, contributing to advancements in semiconductor packaging and waveguide technology.

Collaborations

One of his notable collaborators is Jinbang Tang, with whom he has worked on various projects related to semiconductor innovations.

Conclusion

Neil T. Tracht's contributions to semiconductor technology, particularly through his patent on waveguide interfaces, highlight his role as an influential inventor in the industry. His work continues to impact the efficiency of semiconductor packaging processes, showcasing the importance of innovation in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…