Neil E Robinson

Title: Neil E Robinson: Innovator in Circuit Design

Introduction

Neil E Robinson is a notable inventor based in Ayot St Lawrence, GB. He has made significant contributions to the field of circuit design, particularly with his innovative patent that addresses the complexities of multi-bonded pins in electronic circuits. His work has implications for enhancing the reliability and efficiency of electronic devices.

Latest Patents

Neil E Robinson holds a patent for an "ESD clamp for multi-bonded pins." This invention involves a circuit that comprises a plurality of segments and a clamp circuit. Each segment includes a bond pad connected to a multi-bonded pin through a bond wire, along with a conductor linking the bond pad to an internal connection. The design ensures that the bond pads from all segments connect to the same multi-bonded pin. The clamp circuit features multiple input pins and clamp transistors, which are configured to prevent voltage on the conductors from exceeding specified limits. This innovation is crucial for protecting sensitive electronic components from electrostatic discharge.

Career Highlights

Neil E Robinson is associated with Intersil Americas Inc., where he has contributed to various projects that enhance electronic circuit designs. His expertise in circuit design has positioned him as a valuable asset in the field of electronics.

Collaborations

Throughout his career, Neil has collaborated with notable colleagues, including Claudio Collura and Allan Richard Warrington. These collaborations have fostered an environment of innovation and creativity, leading to advancements in circuit technology.

Conclusion

Neil E Robinson's contributions to circuit design, particularly through his patent for an ESD clamp for multi-bonded pins, highlight his role as an innovator in the electronics industry. His work continues to influence the development of reliable electronic devices.