logo

For the Inventor, By the Inventor

Bergheim, Germany

Neil Brown

This inventor holds 11 USPTO granted patents. Top assignees: Albemarle Corporation, Martinswerk G.m.b.h. Fur Chemische Und Metallurgische Produktion, Alusuisse Martinswerk Gmbh. Active years: 1996-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Neil Brown. Retrieved from https://idiyas.com/inventor/neil-brown-2mji6f8l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 63.6

Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 39(Granted Patents)


Location History:

  • Bergheim/Erft, DE (1996)
  • Bergheim, DE (2001 - 2006)

Company Filing History:

goldMedal6 out of 548 
 
Albemarle Corporation
 patents
silverMedal3 out of 4 
 
Martinswerk G.m.b.h. Fur Chemische Und Metallurgische Produktion
 patents
bronzeMedal1 out of 1 
 
Alusuisse Martinswerk Gmbh
 patent
4. 1 out of 834,513 
Other
 patents

Years Active: 1996-2006

Loading Chart...
11 patents (USPTO):Explore Patents
1. 7063883 - Laminate for printed circuit boards (2006-06-20),
2. 7029746 - Printed circuit boards (2006-04-18),
3. 7029551 - Method for preparing laminates (2006-04-18),
4. 6887454 - Process for the production of aluminium hydroxide (2005-05-03),
5. 6827923 - Process for the production of aluminum hydroxide of improved whiteness (2004-12-07),
6. 6599332 - Process for the production of aluminum hydroxide (2003-07-29),
7. 6514477 - Thermally stable aluminum hydroxide (2003-02-04),
8. 6280839 - Nonhygroscopic thermally stable aluminum hydroxide (2001-08-28),
9. 6171651 - Production of aluminium hydroxide coated glass microspheres (2001-01-09),
10. 5500480 - Process for the production of an aluminum hydroxide Al(OH).sub.3 having (1996-03-19),
11. 5492542 - Process for the production of an aluminum hydroxy Al(OH).sub.3 having (1996-02-20),

Title: Neil Brown - Innovator in Printed Circuit Board Technology

Introduction

Neil Brown is a distinguished inventor based in Bergheim, Germany. He has made significant contributions to the field of printed circuit board technology, holding a total of 11 patents. His innovative work focuses on enhancing the materials and methods used in the production of laminates for printed circuit boards.

Latest Patents

Among his latest patents, Neil has developed a laminate for printed circuit boards that features surface layers of curable resin impregnated woven glass fabric. The intermediate layers consist of curable resin impregnated non-woven glass, which contain 200 percent by weight to 275 percent by weight of a thermally stable aluminum hydroxide. This aluminum hydroxide has a specific molecular formula and specific surface area, measured by the BET method, of 2 to 10 m/g, with a particle size in the D50% range of 5 to 10 micrometers. Additionally, he has patented a method for preparing these laminates, which involves composing together the aforementioned surface and intermediate layers.

Career Highlights

Neil Brown has worked with notable companies in the industry, including Albemarle Corporation and Martinswerk GmbH for Chemical and Metallurgical Production. His experience in these organizations has allowed him to refine his expertise in materials science and engineering.

Collaborations

Throughout his career, Neil has collaborated with esteemed colleagues such as Michael Aggleton and Norbert Putz. These partnerships have contributed to the advancement of his innovative projects and patents.

Conclusion

Neil Brown's contributions to printed circuit board technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced materials and methods in electronics manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…