Company Filing History:
Years Active: 2020
Title: Innovations by Navkamal Rakra in Integrated Circuit Design
Introduction
Navkamal Rakra is an accomplished inventor based in Punjab, India. He has made significant contributions to the field of integrated circuit (IC) design, particularly through his innovative patent that addresses the complexities of multi-die package routing.
Latest Patents
Navkamal Rakra holds a patent titled "System and method to estimate a number of layers needed for routing a multi-die package." This invention focuses on a system and method for implementing an IC package design with an IC package design estimator. The patent includes methods for estimating the number of layers required for an IC package design that incorporates multiple IC die designs. It also addresses the determination of whether the estimated number of layers can meet the routing demands for interconnections between the IC package design and each of the IC die designs. Furthermore, the patent identifies the necessary layers for routing between the IC die designs and determines power or ground layers based on various factors, ultimately generating an output for the IC package design.
Career Highlights
Navkamal Rakra is currently employed at Cadence Design Systems, Inc., where he continues to innovate in the field of IC design. His work has been instrumental in advancing the capabilities of integrated circuit packaging, making it more efficient and effective.
Collaborations
Navkamal collaborates with talented professionals in his field, including Taranjit Singh Kukal and Surender Singh. These collaborations enhance the innovative processes and outcomes of their projects.
Conclusion
Navkamal Rakra's contributions to integrated circuit design through his patent demonstrate his expertise and commitment to innovation. His work at Cadence Design Systems, Inc. continues to influence the future of IC packaging technology.