Nathalie Meunier

Title: Nathalie Meunier: Innovator in High-Density Chip Interconnection

Introduction

Nathalie Meunier is a prominent inventor based in St-Paul-d'Abbotsford, Canada. She has made significant contributions to the field of technology, particularly in the area of chip interconnection systems. Her innovative work has led to the development of a patented technology that enhances the efficiency of electronic devices.

Latest Patents

Nathalie holds a patent for a "High-density chip-to-chip interconnection with silicon bridge." This invention provides a package and system designed for high-density chip-to-chip interconnection. The technology utilizes a plurality of circuit dies, including a laminate substrate adjacent to these dies. It features a conductive spacer positioned between the laminate substrate and one of the circuit dies, along with a silicon bridge and a conductive interposer. The embodiment of this invention can also include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer is made from materials such as laminate, organic, or copper.

Career Highlights

Nathalie is associated with the International Business Machines Corporation (IBM), where she has been able to apply her innovative ideas in a collaborative environment. Her work at IBM has allowed her to contribute to cutting-edge technology in the electronics sector.

Collaborations

Throughout her career, Nathalie has worked alongside notable colleagues, including Francois Arguin and Luc Gilbert Guerin. These collaborations have further enriched her experience and expertise in the field.

Conclusion

Nathalie Meunier is a trailblazer in the realm of high-density chip interconnection technology. Her patented innovations and contributions to IBM highlight her significant role in advancing electronic systems. Her work continues to influence the future of technology in meaningful ways.