This inventor holds 2 USPTO granted patents. Top assignee: Shipley Company LLC. Active years: 2003-2004.
Location History:
- Wolverhampton, GB (2003)
- Wednesfield, GB (2004)
Company Filing History:
Years Active: 2003-2004
Title: Narinder Singh Bains: Innovator in Plating Catalysts
Introduction
Narinder Singh Bains is a notable inventor based in Wednesfield, GB. She has made significant contributions to the field of plating catalysts, holding 2 patents that showcase her innovative work. Her expertise lies in developing catalysts for electroless metallization deposition, which are crucial for various electronic applications.
Latest Patents
Narinder's latest patents include "Plating catalysts and electronic packaging substrates plated therewith." This patent discloses new catalysts for electroless metallization deposition, particularly those that can be selectively activated and may be free of palladium and/or tin. The catalysts she has developed are preferably employed for electroless copper deposition. Another patent titled "Plating catalysts" reveals catalyst compositions suitable for depositing electroless metal seed layers and enhancing discontinuous seed layers. Additionally, it discloses methods for depositing electroless seed layers and enhancing discontinuous seed layers.
Career Highlights
Narinder Singh Bains is currently associated with Shipley Company LLC, where she continues to innovate in her field. Her work has been instrumental in advancing the technology related to plating catalysts, making her a valuable asset to her company and the industry.
Collaborations
Narinder has collaborated with notable coworkers, including Martin T Goosey and David Merricks. These collaborations have further enriched her research and development efforts in the field of plating catalysts.
Conclusion
Narinder Singh Bains is a pioneering inventor whose work in plating catalysts has made a significant impact in the field of electroless metallization. Her contributions continue to influence advancements in electronic packaging and metallization technologies.