Tokyo, Japan

Naoto Kiribe

USPTO Granted Patents = 1 

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovation Spotlight: Naoto Kiribe - Revolutionizing Substrate Bonding in Tokyo

Introduction

Naoto Kiribe is a visionary inventor based in Tokyo, Japan, dedicated to pushing the boundaries of substrate bonding technology. With a keen focus on improving throughput in substrate bonding processes, Kiribe has single-handedly transformed the industry with his groundbreaking patents.

Latest Patents

Kiribe's most notable patent is the "Substrate bonding apparatus and substrate bonding method." This innovative apparatus aims to enhance the efficiency of substrate bonding by creating contact regions that progressively enlarge from the initial contact points on the first and second substrates. The apparatus includes a sophisticated detecting unit that monitors the contact regions and a determining unit that assesses when the bonding process can proceed based on the detected information.

Career Highlights

Currently affiliated with Nikon Corporation, Kiribe continues to drive innovation in the field of substrate bonding. His relentless pursuit of excellence has earned him recognition as a leading figure in the industry, with his patented technologies setting new standards for efficiency and performance.

Collaborations

Kiribe has had the privilege of collaborating with esteemed colleagues such as Isao Sugaya and Eiji Ariizumi. Together, they have combined their expertise to further refine and optimize substrate bonding processes, paving the way for enhanced productivity and quality in the industry.

Conclusion

In conclusion, Naoto Kiribe stands as a trailblazing inventor who has redefined substrate bonding methodologies with his innovative approach. His contributions have not only revolutionized the field but have also inspired a new wave of technological advancements. Tokyo's innovation landscape shines brighter with Kiribe's pioneering work, setting a new benchmark for excellence in substrate bonding technology.

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