Location History:
- Minami-ashigara, JP (2011)
- Fujinomiya, JP (2018)
Company Filing History:
Years Active: 2011-2018
Title: Naoki Nakamura: Innovator in Pressure-Sensitive Adhesives
Introduction
Naoki Nakamura is a prominent inventor based in Fujinomiya, Japan. He has made significant contributions to the field of pressure-sensitive adhesives, holding a total of 2 patents. His innovative work has led to advancements in adhesive technology, particularly in the manufacturing of microcapsules and laminates.
Latest Patents
Nakamura's latest patents include a pressure-sensitive adhesive microcapsule and a pressure-sensitive adhesive microcapsule-containing liquid. The microcapsule encapsulates a radiation-curable gluing agent within a wall film, with an average particle diameter smaller than 500 µm. Additionally, he has developed a gluing sheet that incorporates a layer of these microcapsules on a support. The method for manufacturing this gluing sheet involves applying the microcapsule-containing liquid onto the support and subjecting it to radiation irradiation. Furthermore, he has created a method for manufacturing a laminate by gluing the gluing sheet to an adherend through contact and compression.
Career Highlights
Nakamura is currently employed at Fujifilm Corporation, where he continues to innovate in adhesive technologies. His work has been instrumental in enhancing the performance and application of pressure-sensitive adhesives in various industries.
Collaborations
Some of his notable coworkers include Takahiro Nakazawa and Satoshi Tanaka, who contribute to the collaborative efforts in research and development at Fujifilm Corporation.
Conclusion
Naoki Nakamura's contributions to the field of pressure-sensitive adhesives exemplify the impact of innovative thinking in technology. His patents reflect a commitment to advancing adhesive solutions, making him a key figure in this specialized area.