The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Jul. 20, 2016
Fujifilm Corporation, Tokyo, JP;
Takahiro Nakazawa, Fujinomiya, JP;
Satoshi Tanaka, Fujinomiya, JP;
Yoshihito Hodosawa, Fujinomiya, JP;
Masaki Noro, Fujinomiya, JP;
Daisaku Abiru, Fujinomiya, JP;
Naoki Nakamura, Fujinomiya, JP;
Masashi Yamauchi, Fujinomiya, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
In a pressure-sensitive adhesive microcapsule, a radiation-curable gluing agent is encapsulated by a wall film, and the average particle diameter is smaller than 500 μm. A pressure-sensitive adhesive microcapsule-containing liquid includes the pressure-sensitive adhesive microcapsule and a binder. A gluing sheet includes a layer including the pressure-sensitive adhesive microcapsule on a support. A method for manufacturing the gluing sheet includes forming a layer including a pressure-sensitive adhesive microcapsule on a support by applying the pressure-sensitive adhesive microcapsule-containing liquid onto the support and then carrying out radiation irradiation. A method for manufacturing a laminate includes gluing the gluing sheet and an adherend by bringing a surface of the layer including the pressure-sensitive adhesive microcapsule in the gluing sheet and the adherend into contact with each other and compressing them together.