Naoki Kurosu

Title: Naoki Kurosu: Innovator in Wire Bonding Technology

Introduction

Naoki Kurosu is a prominent inventor based in Fujisawa, Japan. He has made significant contributions to the field of wire bonding technology, holding a total of 3 patents. His innovative approaches have enhanced the reliability and efficiency of various manufacturing processes.

Latest Patents

One of Kurosu's latest patents is a wire bonding method and apparatus. This invention improves the reliability of wire-bonding strength by minimizing variations in the transformation amount of the wire. The process involves exerting a load on the wire at a specific point, where ultrasonic wave vibration is applied to restart the transformation of the wire. This method effectively reduces the variation in the transformation amount, ensuring a more consistent bonding process.

Another notable patent is the ultrasonic bonding performing method and a method for transforming, retaining, and releasing a suspension assembly. This invention features an integrated suspension for a slider in a magnetic recording system, which simplifies the manufacturing process. The design includes a load beam, a flexure, and a mount plate, with a focus on minimizing deflection during ultrasonic bonding.

Career Highlights

Naoki Kurosu is currently associated with International Business Machines Corporation (IBM), where he continues to develop innovative technologies. His work has significantly impacted the field of electronics and manufacturing, showcasing his expertise in wire bonding techniques.

Collaborations

Kurosu has collaborated with notable colleagues, including Tatsushi Yoshida and Kenji Itoh. Their combined efforts have contributed to advancements in their respective fields, further enhancing the impact of their innovations.

Conclusion

Naoki Kurosu's contributions to wire bonding technology exemplify the importance of innovation in manufacturing processes. His patents reflect a commitment to improving reliability and efficiency in the industry.