The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Jul. 17, 2002
Kenji Itoh, Fujisawa, JP;
Naoki Kurosu, Fujisawa, JP;
Yohtaroh Ichimura, Yokohama, JP;
Tatsushi Yoshida, Chigasaki, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P , a bonding wedge abuts the wire , whereby a load is exerted on the wire . The wire transforms by an amount of transformation A, and the transformation stops at point P . The transformation amount A varies greatly. At point P (T ), ultrasonic wave vibration is exerted and the transformation of the wire is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P (T +T ), the transformation amount A+B is maintained substantially constant. At this point P , the transformation amount of the wire is set to 0 and the measurement of the transformation amount of the wire is started. And until the transformation amount of the wire reaches an amount of transformation C (point P ), a load and ultrasonic wave vibration are given.