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For the Inventor, By the Inventor

Toyokawa, Japan

Naoki Hiraiwa

This inventor holds 14 USPTO granted patents and 4 published patent applications. Top assignee: Denso Corporation. Active years: 2006-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoki Hiraiwa. Retrieved from https://idiyas.com/inventor/naoki-hiraiwa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 42.9

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 73(Granted Patents)


Company Filing History:

goldMedal14 out of 20,407 
 
Denso Corporation
 patents

Years Active: 2006-2013

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14 patents (USPTO):Explore Patents
1. 8530281 - Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip (2013-09-10),
2. 7897084 - Manufacturing method of valve unit (2011-03-01),
3. 7846364 - Method and apparatus for manufacturing composite product (2010-12-07),
4. 7374710 - Insert molding apparatus and insert molding method (2008-05-20),
5. 7328507 - Simultaneous forming method of throttle body and throttle valve (2008-02-12),
6. 7111609 - Intake air control device having strain absorbing structure (2006-09-26),
7. 7107683 - Forming method of throttle apparatus for internal combustion engine (2006-09-19),
8. 7107679 - Forming method of throttle apparatus for internal combustion engine (2006-09-19),
9. 7107678 - Forming method of throttle apparatus for internal combustion engine (2006-09-19),
10. 7104254 - Throttle control apparatus having plate-shaped inner connecting member (2006-09-12),
11. 7089663 - Forming method of throttle apparatus for internal combustion engine (2006-08-15),
12. 7069902 - Simultaneous forming method of throttle body and throttle valve (2006-07-04),
13. 7063303 - Throttle apparatus having axial displacement restricting structure (2006-06-20),
14. 7047935 - Throttle body having internally connected double pipe structure (2006-05-23),

Title: Naoki Hiraiwa: Innovator in Semiconductor Technology

Introduction

Naoki Hiraiwa is a prominent inventor based in Toyokawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His innovative approaches have led to advancements in manufacturing methods that enhance the efficiency and reliability of semiconductor modules.

Latest Patents

Hiraiwa's latest patents include a production method for a semiconductor module that features a resin-molded assembly of a heat spreader and a semiconductor chip. This method involves creating a resin molded package that consists of both thermosetting and thermoplastic resin molds. The process ensures a high degree of adhesion between the two molds, minimizing the risk of air gaps and preventing coolant leakage. Another notable patent is a manufacturing method for a valve unit, where the valve and housing are simultaneously molded, incorporating a bearing to support the rotatable shaft. This innovative approach streamlines the manufacturing process and enhances the functionality of the valve unit.

Career Highlights

Hiraiwa is currently employed at Denso Corporation, a leading global automotive supplier. His work at Denso has allowed him to focus on developing cutting-edge technologies that improve the performance of automotive components. His expertise in semiconductor technology has positioned him as a key player in the industry.

Collaborations

Throughout his career, Hiraiwa has collaborated with talented individuals such as Tsuyoshi Arai and Katsuya Torii. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Naoki Hiraiwa's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing manufacturing processes and improving product reliability. His work continues to influence the industry and inspire future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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