Naoaki Ohishi

Title: Naoaki Ohishi: Innovator in Thermal Conductive Materials

Introduction

Naoaki Ohishi is a notable inventor based in Machida, Japan. He has made significant contributions to the field of electronics through his innovative patents. With a total of 2 patents, his work focuses on enhancing thermal conductivity and electrical insulation in various applications.

Latest Patents

One of his latest patents is for a highly thermal conductive and electrical insulating substrate. This invention addresses the limitations of traditional substrate materials used in wiring boards and heat sinks. By utilizing a highly thermal conductive metal plate, such as aluminum, and a specially formulated film composed of metal oxide particles, Ohishi's substrate offers improved thermal conductivity and heat radiation.

Another significant patent involves a method for preparing corundum particles through a hydrothermal process. This method enhances the deposition of alumina on fine corundum particles while minimizing the formation of new corundum crystal nuclei. This innovative approach has potential applications in various industrial processes.

Career Highlights

Throughout his career, Naoaki Ohishi has worked with prominent companies, including Showa Denko Kabushiki Kaisha and Showa Denko K.K. His experience in these organizations has contributed to his expertise in materials science and engineering.

Collaborations

Ohishi has collaborated with notable coworkers such as Toshiaki Sakaida and Mitsuru Hasegawa. Their combined efforts have led to advancements in the development of innovative materials and processes.

Conclusion

Naoaki Ohishi's contributions to the field of thermal conductive materials demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in electronics. His work continues to influence the industry and pave the way for future advancements.