Shenzhen, China

Nanchieh Wang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Udn Packaging Corp.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nanchieh Wang. Retrieved from https://idiyas.com/inventor/nanchieh-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Nanchieh Wang: Innovator in Packaging Solutions

Introduction

Nanchieh Wang is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of packaging technology. His innovative designs focus on enhancing user experience and functionality.

Latest Patents

Nanchieh Wang holds a patent for a unique packaging container. This container features a tube body, a tube head, a roller applicator, and a cover. The design allows the roller applicator to maintain a contact area with the skin of over 65%, providing an improved massage effect. The cover effectively seals the tube head when not in use, preventing any leakage of the inner material.

Career Highlights

Wang is currently associated with UDN Packaging Corp., where he continues to develop innovative packaging solutions. His work has garnered attention for its practicality and effectiveness in various applications.

Collaborations

Wang collaborates with Jiajun Yan, contributing to the advancement of packaging technologies. Their partnership has led to the development of products that meet the evolving needs of consumers.

Conclusion

Nanchieh Wang's contributions to packaging innovation demonstrate his commitment to improving product functionality and user experience. His patent and ongoing work at UDN Packaging Corp. highlight his role as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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