Company Filing History:
Years Active: 2017
Title: Nampyo Lee: Innovator in Wafer Processing Technology
Introduction
Nampyo Lee is a notable inventor based in Cedar Park, TX (US). He has made significant contributions to the field of semiconductor processing, particularly with his innovative patent that enhances the efficiency of wafer cleaning processes.
Latest Patents
Nampyo Lee holds a patent for "Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber." This invention describes a system and method that concurrently processes multiple wafers. The cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck features a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. This mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers. This innovative approach significantly improves the efficiency of wafer processing.
Career Highlights
Throughout his career, Nampyo Lee has worked with prominent companies in the semiconductor industry. He has been associated with Samsung Electronics Co., Ltd. and Samsung Austin Semiconductor, LP. His experience in these organizations has contributed to his expertise in wafer processing technologies.
Collaborations
Nampyo Lee has collaborated with talented individuals in his field, including Amuldeep S Brar and Woosung Han. These collaborations have likely fostered innovation and advancements in semiconductor processing techniques.
Conclusion
Nampyo Lee is a distinguished inventor whose work in wafer processing technology has made a significant impact on the semiconductor industry. His innovative patent demonstrates his commitment to improving efficiency in wafer cleaning processes.
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