This inventor holds 1 USPTO granted patent. Top assignee: Kyocera Avx Components Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovations of Nahum Bohmstein
Introduction
Nahum Bohmstein is a notable inventor based in Modi-n-Maccabim-Re'ut, Israel. He has made significant contributions to the field of thin-film technology, particularly with his innovative designs that enhance the performance of electronic components. His work is characterized by a focus on compact and efficient solutions that meet the demands of modern technology.
Latest Patents
Nahum Bohmstein holds a patent for a "Compact thin-film surface mountable coupler." This invention features a surface mountable thin-film coupler that includes a monolithic base substrate and a plurality of ports formed over the substrate. The coupler is designed to provide a coupling factor greater than −5 dB and less than −1 dB over a frequency range starting above 1 GHz, with an upper bound at least 200 MHz greater than the lower bound. Notably, the footprint of the coupler is less than about 3 mm, making it an efficient solution for space-constrained applications.
Career Highlights
Bohmstein's career is marked by his role at Kyocera AVX Components Corporation, where he has been instrumental in developing advanced electronic components. His expertise in thin-film technology has positioned him as a key player in the industry, contributing to the company's reputation for innovation and quality.
Collaborations
Throughout his career, Nahum has collaborated with talented individuals such as Michael Marek and Elinor O'Neill. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Nahum Bohmstein's contributions to the field of thin-film technology exemplify the spirit of innovation that drives progress in electronics. His patented designs and collaborative efforts continue to influence the industry, showcasing the importance of creativity and teamwork in achieving technological advancements.
