Singapore, Singapore

Nagadeven Karunakaran

This inventor holds 1 USPTO granted patent. Top assignee: Xilinx, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nagadeven Karunakaran. Retrieved from https://idiyas.com/inventor/nagadeven-karunakaran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Nagadeven Karunakaran

Introduction

Nagadeven Karunakaran is a notable inventor based in Singapore, known for his contributions to micro device technology. He has developed innovative solutions that enhance heat transfer in micro devices, showcasing his expertise in the field.

Latest Patents

One of his significant patents is titled "Micro device with through PCB cooling." This invention focuses on micro devices that feature enhanced heat transfer through printed circuit boards (PCBs). The patent describes a micro device that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The design allows for efficient thermal management, ensuring optimal performance of micro devices.

Career Highlights

Nagadeven Karunakaran is currently employed at Xilinx, Inc., where he continues to innovate and contribute to advancements in technology. His work has garnered attention for its practical applications in the industry.

Collaborations

He has collaborated with notable colleagues, including Gamal Refai-Ahmed and Hoa Lap Do, further enhancing the innovative environment at Xilinx, Inc.

Conclusion

Nagadeven Karunakaran's contributions to micro device technology, particularly through his patent on PCB cooling, highlight his role as a significant inventor in the field. His work continues to influence advancements in thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…