This inventor holds 1 USPTO granted patent and 12 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Myungdo Cho - Innovator in Semiconductor Packaging
Introduction
Myungdo Cho is an inventor based in Suwon-si, South Korea. He is recognized for his contributions to the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
1. **SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE** - This application describes a semiconductor package that includes a lower redistribution wiring layer, a bridge chip with a bump structure, a sealing member, vertical conductive structures, and an upper redistribution wiring layer. The design allows for efficient electrical connections between multiple semiconductor devices.
2. **SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING THE SAME** - This application details an interposer that features a first redistribution structure and a device stack structure. The device stack includes multiple integrated stack capacitor structures and is covered by a molding material, enhancing the overall functionality and reliability of the semiconductor package.
Conclusion
Myungdo Cho's work in semiconductor packaging showcases his innovative approach to technology, even in the absence of granted patents. His latest patent applications reflect a commitment to advancing the field and highlight his potential as an inventor.