Chester, NJ, United States of America

Myron D Schatzberg

This inventor holds 1 USPTO granted patent. Top assignee: Carlisle Corporation. Active years: 1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Myron D Schatzberg. Retrieved from https://idiyas.com/inventor/myron-d-schatzberg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Myron D. Schatzberg: Innovator in Solderable Elements

Introduction

Myron D. Schatzberg is a notable inventor based in Chester, NJ (US). He has made significant contributions to the field of solderable elements, showcasing his innovative spirit and technical expertise. With a focus on enhancing solderability characteristics, Schatzberg's work has implications for various applications in electronics and manufacturing.

Latest Patents

Schatzberg holds a patent for "Solderable elements and method for forming same." This invention involves a wire that is enhanced for solderability by applying a very thin, uniform coat of silver to a clean copper wire substrate. A coat of tin is then plated on top of the silver. The heat treatment process causes the silver and tin to form an interface alloy, improving the overall performance of the wire. Notably, the device can be other than a wire, and the substrate can be other than copper, showcasing the versatility of his invention. He has 1 patent to his name.

Career Highlights

Myron D. Schatzberg is associated with Carlisle Corporation, where he continues to apply his innovative ideas and technical skills. His work at the company reflects his commitment to advancing technology in the field of solderable elements.

Collaborations

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Conclusion

Myron D. Schatzberg's contributions to the field of solderable elements highlight his innovative approach and technical proficiency. His patent demonstrates the potential for enhanced solderability in various applications, marking him as a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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