This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, Other. Active years: 2003-2026.
Company Filing History:
1 out of 8,816 
1 out of 834,411 Years Active: 2003-2026
Title: Myriam Assous: Innovator in Copper Connection Technologies
Introduction
Myriam Assous is a prominent inventor based in Grenoble, France, recognized for his significant contribution to the field of integrated circuit technology. With a focused expertise in developing innovative methods for producing copper connections, he has successfully obtained a patent that showcases his ingenuity and technical proficiency.
Latest Patents
Myriam Assous is the inventor of a patent titled "Method for Producing a Copper Connection." This invention details a process essential for creating a copper connection within integrated circuits that employ a damascene structure. The method includes multiple steps: etching the dielectric material layer to reach the encapsulation layer, forming a protective layer to mitigate contamination, and ultimately filling the connection hole with copper, ensuring a reliable and efficient conduit for electrical connectivity.
Career Highlights
Throughout his career, Myriam Assous has made substantial contributions to the semiconductor industry, particularly in enhancing the reliability of connections within integrated circuits. His unique approach to addressing the challenges of dielectric materials and connection methods has paved the way for improved performance in electronic devices.
Collaborations
Myriam has collaborated with esteemed colleagues Yves Morand and Yveline Gobil, who have played significant roles in advancing his projects and research initiatives. Together, they have worked to refine and innovate processes that enhance the performance and functionality of semiconductor technologies.
Conclusion
With a patent that stands as a testament to his inventive capabilities, Myriam Assous continues to impact the technological landscape. His focus on improving copper connection methods reflects a commitment to innovation in the realm of integrated circuits, establishing him as a key contributor to advancements in the field.