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For the Inventor, By the Inventor

Incheon, South Korea

Myong Hwan Park

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Ymt Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Myong Hwan Park. Retrieved from https://idiyas.com/inventor/myong-hwan-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:

goldMedal2 out of 8 
 
Ymt Co., Ltd.
 patents

Years Active: 2025

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2 patents (USPTO):Explore Patents
1. 12495494 - Metal foil, carrier with metal foil comprising the same and printed circuit board including the same (2025-12-09),
2. 12408279 - Release layer for metal foil with carrier and metal foil comprising the same (2025-09-02),

Title: Myong Hwan Park: Innovator in Metal Foil Technology

Introduction

Myong Hwan Park is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of metal foil technology, holding 2 patents that enhance the efficiency and functionality of printed circuit boards.

Latest Patents

His latest patents include innovations such as a metal foil with a rough surface and a carrier-attached metal foil. The first patent focuses on a metal foil that naturally forms a rough surface during its creation. This rough surface increases the adhesive strength to insulating resin substrates, leading to improved manufacturing efficiency for printed circuit boards. The second patent introduces a release layer for a metal foil with a carrier, designed for easy removal. This release layer incorporates nitrogenous heterocyclic compounds and inorganic compounds containing metals like nickel and cobalt.

Career Highlights

Myong Hwan Park is currently employed at YMT Co., Ltd., where he continues to develop innovative solutions in the field of electronics. His work has been instrumental in advancing the technology used in printed circuit boards, making them more efficient and reliable.

Collaborations

He collaborates with talented individuals such as Sung Wook Chun and Bo Mook Chung, contributing to a dynamic team focused on innovation.

Conclusion

Myong Hwan Park's contributions to metal foil technology exemplify the impact of innovative thinking in the electronics industry. His patents not only enhance product efficiency but also pave the way for future advancements in printed circuit board manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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