Company Filing History:
Years Active: 2025
Title: Myeongho Hong: Innovator in Semiconductor Packaging
Introduction
Myeongho Hong is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor packaging, particularly through his innovative designs and methods.
Latest Patents
Myeongho Hong holds a patent for a "Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package." This patent describes a package structure that includes a core substrate with a substrate base featuring multiple first and second cavities. The design incorporates a plurality of blocks within the second cavities and bridge structures extending between the blocks and the substrate base. Additionally, it includes semiconductor chips placed in the first cavities and a molding layer that covers both the core substrate and the semiconductor chips, with portions of the molding layer situated in the first and second cavities. This invention enhances the efficiency and reliability of semiconductor packages.
Career Highlights
Myeongho Hong is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to focus on advancing semiconductor technologies and improving packaging solutions.
Collaborations
Myeongho collaborates with Jangbae Son, a fellow innovator in the field. Their partnership contributes to the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Myeongho Hong's innovative work in semiconductor packaging exemplifies the importance of advancements in technology. His patent and contributions to Samsung Electronics Co., Ltd. highlight his role as a key player in the industry.