Suwon-si, South Korea

Myeong Ho Hong

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 56(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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3 patents (USPTO):Explore Patents

Title: Myeong Ho Hong: Innovator in Semiconductor Technology

Introduction

Myeong Ho Hong is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving semiconductor package substrates, which are crucial for the performance and reliability of electronic devices.

Latest Patents

Myeong Ho Hong's latest patents include innovative methods for manufacturing semiconductor package substrates. One of his notable inventions involves a semiconductor package substrate that includes a semiconductor chip with a connection pad. This design features an encapsulant that encapsulates at least a portion of the semiconductor chip. Additionally, a connection member is disposed on the semiconductor chip and the encapsulant, which includes a redistribution layer electrically connected to the connection pad. The invention also incorporates a first passivation layer on the connection member and an adhesive layer on the top surface of the encapsulant and the bottom surface of the first passivation layer, specifically in regions outside of the semiconductor chip.

Career Highlights

Myeong Ho Hong has had a distinguished career, working with leading companies in the technology sector. He has been associated with Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd., where he has contributed to various projects and innovations in semiconductor technology.

Collaborations

Throughout his career, Myeong Ho Hong has collaborated with notable professionals in the field, including Tae Ho Ko and Dae Hee Lee. These collaborations have further enhanced his contributions to semiconductor innovations.

Conclusion

Myeong Ho Hong is a key figure in the semiconductor industry, with a focus on developing advanced package substrates. His patents reflect his commitment to innovation and excellence in technology. His work continues to influence the future of electronic devices and semiconductor applications.

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