The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Mar. 27, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Tae Ho Ko, Suwon-si, KR;
Dae Hee Lee, Suwon-si, KR;
Bong Soo Kim, Suwon-si, KR;
Myeong Ho Hong, Suwon-si, KR;
Do Young Jeong, Suwon-si, KR;
Joon Seok Oh, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip, a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip. The fan-out semiconductor package may have excellent rigidity, may be thinned, and may be manufactured in a simplified process.