This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: Mutsuko Hayama: Innovator in Metal-Core Printed Wiring Boards
Introduction
Mutsuko Hayama is a distinguished inventor based in Hyogo, Japan. She has made significant contributions to the field of printed circuit board technology. Her innovative work has led to the development of a unique metal-core printed wiring board.
Latest Patents
Mutsuko Hayama holds a patent for a "Metal-core printed wiring board and a process for manufacture thereof." This invention outlines a method for manufacturing printed circuit boards using a core metal sheet with a through hole. The process involves laying a plurality of prepreg sheets composed of ceramic paper on each side of the core metal sheet. These sheets contain varying quantities of resin and are pressed together with copper foil to create a reliable and efficient metal-core printed wiring board. The insulating layer formed by the prepreg sheets has a high heat-dissipating capacity, enhancing the board's performance.
Career Highlights
Mutsuko Hayama is associated with Mitsubishi Denki Kabushiki Kaisha, where she has been instrumental in advancing technology in her field. Her work has not only contributed to her company but has also had a broader impact on the electronics industry.
Collaborations
Mutsuko has collaborated with notable colleagues, including Yoshio Nishimoto and Minoru Kimura. These partnerships have fostered innovation and development in their projects.
Conclusion
Mutsuko Hayama's contributions to the field of printed circuit boards exemplify her innovative spirit and dedication to technology. Her patent and work at Mitsubishi Denki Kabushiki Kaisha highlight her role as a leading inventor in her industry.