Los Angeles, CA, United States of America

Mutian Hua

This inventor holds 2 USPTO granted patents. Top assignee: University of California. Active years: 2023-2026.


% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023-2026

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2 patents (USPTO):Explore Patents

Title: Innovations of Mutian Hua in Metal Printing Technology

Introduction

Mutian Hua is a prominent inventor based in Los Angeles, CA. He has made significant contributions to the field of metal printing technology. With a total of 2 patents, his work focuses on enhancing the mechanical properties of materials through innovative methods.

Latest Patents

Hua's latest patents include groundbreaking technologies such as a Hierarchically Structured Hydrogel with Tunable Mechanical Properties. Additionally, he has developed methods for photo-induced metal printing. His inventions also encompass methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D metal structures. These methods operate via photo-(stereo)lithography at room temperature. The printed metal patterns, particularly silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of silver printed by current laser sintering or thermal annealing at high temperatures.

Career Highlights

Mutian Hua is affiliated with the University of California, where he continues to push the boundaries of research and innovation. His work has garnered attention for its potential applications in various industries, particularly in electronics and materials science.

Collaborations

Hua collaborates with notable colleagues such as Ximin He and Xingyun Yang. Their combined expertise contributes to the advancement of their research projects and innovations.

Conclusion

Mutian Hua's contributions to metal printing technology exemplify the intersection of creativity and scientific advancement. His patents reflect a commitment to improving material properties and expanding the possibilities within the field.

Profile summary based on public USPTO records.
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