Musawir M Chowdhury

Title: Musawir M. Chowdhury: Integrated Circuit Packaging Inventor.

Introduction

Musawir M. Chowdhury is an inventor associated with Whitehall, Pennsylvania, and Agere Systems Inc. His patent work addresses electroplating methods for integrated circuit packages.

Latest Patents

Chowdhury is credited with 1 patent: “Methods for Processing Integrated Circuit Packages Formed Using Electroplating and Apparatus Made Therefrom.” The invention describes electroplating an integrated circuit package without forming plating traces on the conductive surface of its pad side. This allows pad areas to be plated with one or more materials. An integrated circuit can then be electrically coupled to those pad areas. The process uses one or more current sources connected to the package’s back plane, which is patterned after electroplating.

Career Highlights

Chowdhury’s listed patent is associated with Agere Systems Inc. It focuses on a packaging process designed to plate package pads while postponing back-plane patterning until after electroplating.

Collaborations

Charles Cohn is identified as Chowdhury’s coworker. The available information does not specify their roles or describe a particular joint project.

Conclusion

Musawir M. Chowdhury’s patent documents an approach to electroplating integrated circuit packages that avoids plating traces on the pad-side conductive surface and patterns the back plane after plating.