This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Qualcomm Innovation Center, Inc.. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Murali Dhulipala: Innovator in Work Item Management
Introduction
Murali Dhulipala is a notable inventor based in Rayakuduru, India. He has made significant contributions to the field of computing, particularly in the area of work item management among worker threads. His innovative approach has the potential to enhance the efficiency of computing devices.
Latest Patents
Murali holds a patent for a system that focuses on work item management among worker threads of a computing device. The patent, titled "Work item management among worker threads of a computing device," describes systems, methods, and apparatus for performing load balancing of work queues via a dispatcher. This dispatcher can be integrated into the kernel and is capable of monitoring work item workload histories to estimate the workload that each work item will add to a scheduled thread. When a workload is predicted to trigger performance scaling of a processor, the dispatcher can reschedule work items to ensure optimal performance.
Career Highlights
Murali Dhulipala is currently employed at Qualcomm Innovation Center, Inc. His work at Qualcomm has allowed him to explore and develop innovative solutions that address complex challenges in computing. His expertise in load balancing and performance optimization has made him a valuable asset to his team.
Collaborations
Murali has collaborated with several talented individuals in his field, including Krishna V S S S R Vanka and Sravan Kumar Ambapuram. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Murali Dhulipala is a distinguished inventor whose work in work item management has the potential to significantly improve computing efficiency. His contributions to the field are noteworthy, and his ongoing work at Qualcomm Innovation Center, Inc. continues to pave the way for future innovations.