Mun Hooi Yaow

Title: The Innovative Contributions of Mun Hooi Yaow

Introduction

Mun Hooi Yaow is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuits and fluid ejection devices. With a total of 4 patents to his name, he has made significant advancements in technology that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents, one focuses on integrated circuits. This invention includes a first metal layer and a second metal layer that is capacitively coupled to the first through a dielectric layer. Notably, the second metal layer features an electron leakage path, allowing for controlled charge leakage over a predetermined time period. Another significant patent is for a fluid ejection device, which comprises a substrate with a chamber designed to contain fluid. This device includes a metal layer with a resistor thermally coupled to the chamber, and a polysilicon layer that alters the topography of the resistor to create an uneven surface, enhancing its performance.

Career Highlights

Mun Hooi Yaow is currently employed at Hewlett-Packard Development Company, L.P., where he continues to innovate and develop new technologies. His work has contributed to the advancement of electronic devices, making them more efficient and effective in various applications.

Collaborations

Throughout his career, Mun has collaborated with talented individuals such as Ning Ge and Bee Ling Peh, who have contributed to his projects and innovations.

Conclusion

Mun Hooi Yaow's inventive spirit and dedication to technology have led to significant advancements in integrated circuits and fluid ejection devices. His contributions continue to impact the field positively, showcasing the importance of innovation in technology.