The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Apr. 30, 2014
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Reynaldo V Villavelez, Corvallis, OR (US);
Ning Ge, Palo Alto, CA (US);
Mun Hooi Yaow, Singapore, SG;
Erik D Ness, Vancouver, WA (US);
David B Novak, Philomath, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/43 (2006.01); H01L 29/423 (2006.01); H01L 21/28 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42324 (2013.01); H01L 29/40114 (2019.08); H01L 29/42332 (2013.01); H01L 28/60 (2013.01);
Abstract
The present subject matter relates to an integrated circuit. The integrated circuit includes a first metal layer and a second metal layer capacitively coupled to the first metal layer through a dielectric layer. Further, the second metal layer includes an electron leakage path to provide for leakage of charge from the second metal layer in a predetermined leak time period.