Muhammad Tayyab Qureshi

Title: Muhammad Tayyab Qureshi: Innovator in Multilayer Embedded Packaging Technology

Introduction

Muhammad Tayyab Qureshi is a notable inventor based in Neubiberg, Germany. He has made significant contributions to the field of multilayer embedded packaging technology, particularly in the area of electromagnetic band gap structures.

Latest Patents

Qureshi holds a patent for the "Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave." This innovative patent describes a packaged radar that includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna, and a receive antenna. The electromagnetic band gap structure is designed to isolate the transmit and receive antennas, enhancing performance in multilayer embedded packaging technology.

Career Highlights

He is currently employed at Infineon Technologies AG, where he continues to work on advanced technologies that push the boundaries of embedded systems. His expertise in multilayer packaging has positioned him as a key player in the industry.

Collaborations

Some of his coworkers include Ashutosh Baheti and Marwa Abdel-Aziz, who collaborate with him on various projects within the company.

Conclusion

Muhammad Tayyab Qureshi's innovative work in multilayer embedded packaging technology exemplifies the impact of dedicated inventors in advancing modern technology. His contributions are paving the way for future developments in the field.