Ansan-si, South Korea

Mu Chang Sung

This inventor holds 1 USPTO granted patent. Top assignee: Plastal Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mu Chang Sung. Retrieved from https://idiyas.com/inventor/mu-chang-sung-4mfwuci2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mu Chang Sung: Inventor of a Metal–Polymer Bonding Method.

Introduction

Mu Chang Sung is an inventor associated with Ansan-si, South Korea. Her work includes a patented method for preparing metal–polymer resin composites, designed to improve bonding strength and uniformity. The supplied information lists 1 patent and identifies Plastal GmbH as her company.

Latest Patents

Her listed patent, “Method for Preparing Metal-Polymer Resin Composite,” describes a process for bonding polymer resin to a metal member. The method involves etching the metal, forming an adhesive coating layer through electrolysis, drying the coated metal, and then bonding the polymer resin by injection molding. The electrolysis uses an electrolyte solution containing a sulfur-containing compound and a metal chelate compound. The disclosure presents this process as a way to achieve strong, uniform bonding.

Career Highlights

The available information connects Mu Chang Sung with Plastal GmbH and identifies her patent as focused on materials processing and metal–polymer composite preparation. The described method combines surface pretreatment, electrochemical coating, drying, and injection molding.

Collaborations

Seok Hyun Nam and Sung Ho Hong are listed as her coworkers. The supplied information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Mu Chang Sung’s listed invention addresses the preparation of metal–polymer resin composites through a multistep process intended to improve bonding strength and uniformity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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