IDiyas

For the Inventor, By the Inventor

Kawasaki, Japan

Motoyuki Nishizawa

USPTO Granted Patents = 13

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 66(Granted Patents)


Company Filing History:

goldMedal13 out of 39,228 
 
Fujitsu Corporation
 patents
silverMedal1 out of 26 
 
Fujitsu Isotec Limited
 patents
where one patent can have more than one assignee

Years Active: 1999-2011

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13 patents (USPTO):
1. 7956468 - Semiconductor device (2011-06-07),
2. 7709293 - Semiconductor device and manufacturing method of the semiconductor device (2010-05-04),
3. 7565047 - Optical waveguide structure, optical module and lens array (2009-07-21),
4. 7359594 - Optical waveguide structure and optical module (2008-04-15),
5. 6947625 - Optical deflector and optical switch (2005-09-20),
6. 6879739 - Optical deflector and optical switch (2005-04-12),
7. 6873751 - Optical waveguide device and method for fabricating the same (2005-03-29),
8. 6781290 - Piezoelectric actuator, method of manufacturing the same, ink-jet head using the same, and ink-jet printer (2004-08-24),
9. 6504966 - Optical deflecting element, optical switch module, light signal switching device (2003-01-07),
10. 6156259 - Method of manufacturing piezoelectric materials (2000-12-05),
11. 6097412 - Ink jet printer head and method for fabricating the same including a (2000-08-01),
12. 5962955 - Piezoelectric device and method for fabricating the same, and ink jet (1999-10-05),
13. 5906481 - Piezoelectric fluid pump (1999-05-25),

Title: The Innovations of Motoyuki Nishizawa

Introduction

Motoyuki Nishizawa is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work has been instrumental in advancing the capabilities of semiconductor devices.

Latest Patents

Nishizawa's latest patents focus on innovative semiconductor devices. One notable patent describes a semiconductor device where an outside connection terminal of a semiconductor element and an electrode of a wiring board are connected via a conductive adhesive. This adhesive includes a first conductive adhesive and a second conductive adhesive covering the first. The first conductive adhesive contains a conductive filler, including silver (Ag), while the second contains a conductive filler selected from metals such as tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), palladium (Pd), and platinum (Pt). Another patent elaborates on the manufacturing method of this semiconductor device, emphasizing the same innovative connection techniques.

Career Highlights

Throughout his career, Motoyuki Nishizawa has worked with notable companies, including Fujitsu Corporation and Fujitsu Isotec Limited. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor technology, contributing to his impressive patent portfolio.

Collaborations

Nishizawa has collaborated with esteemed colleagues, including Masatoshi Ishii and Yasuo Yamagishi. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Motoyuki Nishizawa's contributions to semiconductor technology through his patents and collaborations highlight his importance as an inventor. His innovative approaches continue to influence the industry and pave the way for future advancements.

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