Kyoto, Japan

Motonari Fujikawa

This inventor holds 1 USPTO granted patent. Top assignee: Omron Corporation. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Motonari Fujikawa. Retrieved from https://idiyas.com/inventor/motonari-fujikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Motonari Fujikawa: Innovator in Electronic Component Manufacturing

Introduction

Motonari Fujikawa is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of electronic component manufacturing. His innovative approach has led to the development of a unique method for producing molded electronic components.

Latest Patents

Fujikawa holds a patent for a method of manufacturing an electronic component by seal-molding with resin. This process involves a die pad mounted with an electronic element and numerous input-and-output terminals supported by a lead frame. The method includes several steps, such as resin molding a first mold member on the leads, cutting suspending pins, and resin-molding a second mold member to cover the cut ends. This innovative technique enhances the efficiency and reliability of electronic components.

Career Highlights

Motonari Fujikawa is currently employed at Omron Corporation, a leading company in automation and electronic components. His work at Omron has allowed him to apply his inventive skills in a practical setting, contributing to advancements in technology.

Collaborations

Fujikawa has collaborated with esteemed colleagues such as Syuichi Sugimoto and Shinji Nakamura. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Motonari Fujikawa's contributions to the field of electronic component manufacturing exemplify the spirit of innovation. His patented methods and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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