Motoi Suga

Title: Motoi Suga: Innovator in Printed Wiring Board Technology

Introduction

Motoi Suga is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of printed wiring board technology. With a total of 2 patents, his work focuses on enhancing the durability and functionality of printed wiring boards.

Latest Patents

Motoi Suga's latest patents include a method of making a metal cored printed wiring board. This innovation ensures that an organic non-conductive layer does not separate from the metal core, even in high temperature and high humidity environments. The design incorporates a metal plated layer, such as nickel, between the organic non-conductive layer and the metal core, which is typically made of aluminum. Additionally, a metal oxide layer is utilized to enhance the adhesive force, effectively preventing separation. This protective metal plated layer also safeguards the metal core from erosion caused by strong alkali solutions used in the manufacturing process. Furthermore, the design allows for easy copper plating inside the through hole.

Career Highlights

Motoi Suga is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to further develop his innovative ideas and contribute to advancements in technology.

Collaborations

One of his notable coworkers is Shuhichi Endoh, with whom he has collaborated on various projects.

Conclusion

Motoi Suga's contributions to printed wiring board technology demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of materials and manufacturing processes, paving the way for future advancements in the field.