Company Filing History:
Years Active: 2009
Title: Motoi Nezu: Innovator in Semiconductor Technology
Introduction
Motoi Nezu is a prominent inventor based in Mitaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative approaches have advanced the methods used in semiconductor wafer processing.
Latest Patents
Nezu's latest patents include a method of grinding the back surface of semiconductor wafers and an apparatus for peeling surface protective films. The grinding method involves measuring the initial thickness of the semiconductor wafer before grinding, obtaining a cutting depth, and grinding the back surface based on that depth. This process ensures precision and efficiency in semiconductor manufacturing. The peeling method utilizes a heating block to weaken the adhesion between the wafer and the protective film, allowing for a clean and damage-free removal.
Career Highlights
Motoi Nezu is currently employed at Tokyo Seimitsu Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in improving the efficiency and effectiveness of semiconductor wafer processing techniques.
Collaborations
Nezu collaborates with notable colleagues, including Masaki Kanazawa and Minoru Ametani. Their combined expertise contributes to the advancement of semiconductor technologies and the development of innovative solutions in the industry.
Conclusion
Motoi Nezu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.