Wilkins Township, PA, United States of America

Morris A Mendelsohn


Average Co-Inventor Count = 1.9

ph-index = 9

Forward Citations = 165(Granted Patents)


Location History:

  • Pittsburgh, PA (US) (1976)
  • Wilkins Township, Allegheny County, PA (US) (1978 - 1988)
  • Wilkins Twp., Allegheny County, PA (US) (1986 - 1995)

Company Filing History:


Years Active: 1976-1995

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12 patents (USPTO):Explore Patents

Title: The Innovations of Morris A. Mendelsohn

Introduction

Morris A. Mendelsohn is a notable inventor based in Wilkins Township, PA (US). He has made significant contributions to the field of acoustic materials, holding a total of 12 patents. His work focuses on developing innovative solutions for sound absorption and decoupling.

Latest Patents

Mendelsohn's latest patents include a sound-absorbing syntactic foam, which comprises expanded polystyrene microspheres dispersed randomly in a polyurethane matrix. This invention aims to enhance sound absorption in various applications. Another notable patent is for an acoustic foam composition that includes a polybutadiene-based polyol, diisocyanate, and hollow polymeric microspheres. This composition is designed to provide excellent acoustic properties, making it valuable in soundproofing and noise reduction.

Career Highlights

Morris A. Mendelsohn has had a distinguished career at Westinghouse Electric Corporation, where he has applied his expertise in acoustics to develop advanced materials. His innovative approaches have led to significant advancements in sound-absorbing technologies.

Collaborations

Mendelsohn has collaborated with several professionals in his field, including Francis W. Navish, Jr. and Richard Bolton. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Morris A. Mendelsohn's contributions to acoustic materials through his patents and work at Westinghouse Electric Corporation highlight his role as a leading inventor in the field. His innovations continue to impact sound absorption technologies significantly.

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