Tokyo, Japan

Morio Mori


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Morio Mori - Innovator in Heat-Resistant Materials

Introduction

Morio Mori is a distinguished inventor based in Tokyo, Japan. He is known for his contributions to the field of materials science, particularly in the development of heat-resistant film base-material-inserted B-stage resin composition sheets. His innovative work has significant implications for the electronics industry.

Latest Patents

Morio Mori holds a patent for a heat-resistant film base-material-inserted B-stage resin composition sheet designed for lamination. This invention is particularly valuable for producing multilayer printed wiring boards that exhibit excellent copper adhesive strength, heat resistance, and insulating reliability, especially in the Z direction. It is suitable for use in high-density, small printed wiring boards, particularly in semiconductor-chip-mounting applications and lightweight semiconductor plastic packages.

Career Highlights

Morio Mori is currently employed at Mitsubishi Gas Chemical Company, Inc., where he continues to innovate and develop advanced materials. His work has contributed to the company's reputation as a leader in chemical manufacturing and materials development.

Collaborations

Morio has collaborated with Nobuyuki Ikeguchi, a fellow innovator, to further enhance the capabilities and applications of their inventions.

Conclusion

Morio Mori's contributions to heat-resistant materials and his innovative patent demonstrate his significant impact on the electronics industry. His work continues to pave the way for advancements in semiconductor technology and materials science.

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