The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Feb. 20, 2003
Applicants:
Nobuyuki Ikeguchi, Tokyo, JP;
Morio Mori, Tokyo, JP;
Inventors:
Nobuyuki Ikeguchi, Tokyo, JP;
Morio Mori, Tokyo, JP;
Assignee:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B003/00 ;
U.S. Cl.
CPC ...
Abstract
The present invention relates to a heat-resistant film base-material-inserted B-stage resin composition sheet for producing a multilayer printed wiring board which is excellent in copper adhesive strength, heat resistance and insulating reliability particularly in the Z direction and is suitable for use, as a high density small printed wiring board, in a semiconductor-chip-mounting, small-sized and lightweight novel semiconductor plastic package, and to a use thereof.