Morimichi Umino

Title: Morimichi Umino: Innovator in Resin Composition and Printed Wiring Boards

Introduction

Morimichi Umino is a notable inventor based in Hitachiota, Japan. He has made significant contributions to the field of materials science, particularly in resin compositions and printed wiring boards. With a total of six patents to his name, Umino's work has had a considerable impact on various industries.

Latest Patents

Umino's latest patents include innovations in resin composition, prepreg, laminate sheets, and printed wiring boards. His patented resin composition features a crosslinking component with a weight average molecular weight of 1,000 or less, which contains multiple styrene groups. This composition is designed to include a high-molecular weight compound, an inorganic filler, and a treating agent for the inorganic filler. The resulting cured product is utilized in prepregs, laminate sheets with conductor layers, and multilayer printed wiring boards, showcasing Umino's expertise in advanced materials.

Career Highlights

Throughout his career, Morimichi Umino has worked with prominent companies such as Hitachi, Ltd. and Hitachi Chemical Company, Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas, leading to his successful patent applications.

Collaborations

Umino has collaborated with notable colleagues, including Akira Nagai and Yuichi Satsu. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Morimichi Umino's contributions to resin compositions and printed wiring boards highlight his role as a significant inventor in the field. His innovative patents and collaborations reflect his dedication to advancing technology and materials science.