This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: The University of Texas System. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Innovations of Mohammad S Rahman in Microelectromechanical Systems
Introduction
Mohammad S Rahman is a notable inventor based in South Bend, IN (US). He has made significant contributions to the field of microelectromechanical systems (MEMS). His innovative work has led to the development of advanced packaging methods for MEMS devices.
Latest Patents
Rahman holds a patent for "Methods and apparatuses for integrated packaging of microelectromechanical devices." This patent encompasses various aspects of MEMS packages, including the methods for creating these packages. The method involves forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. Additionally, it includes forming a packaging layer above the chamber sacrificial layer and creating openings through the packaging layer. The process also entails removing the chamber sacrificial layer through these openings and forming a sealing layer above the packaging layer to create a hermetic cavity.
Career Highlights
Currently, Mohammad S Rahman is associated with the University of Texas System. His work in this esteemed institution has allowed him to further his research and development in MEMS technology. His innovative approach has garnered attention in the field, showcasing his expertise and dedication.
Collaborations
Rahman has collaborated with notable colleagues, including Murali M Chitteboyina and Donald Philip Butler. These collaborations have contributed to the advancement of research in microelectromechanical systems.
Conclusion
In summary, Mohammad S Rahman is a distinguished inventor whose work in microelectromechanical systems has led to innovative packaging methods. His contributions continue to impact the field significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
