CA

Mohammad Matiar Rahman Howlader

This inventor holds 1 USPTO granted patent. Top assignee: Ayumi Industry. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mohammad Matiar Rahman Howlader. Retrieved from https://idiyas.com/inventor/mohammad-matiar-rahman-howlader

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Innovations of Mohammad Matiar Rahman Howlader

Introduction

Mohammad Matiar Rahman Howlader is an accomplished inventor based in California. He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of bonding processes.

Latest Patents

One of his notable patents is titled "Method for bonding substrates and device for bonding substrates." This patent describes a method that involves irradiating the surfaces of substrates in a vacuum using both an inert gas beam and a metal beam. This process results in the formation of island-shaped thin metal films on the surfaces of the substrates. The bonding of the substrates is achieved through surface-activated bonding, where the substrates are brought into contact with each other.

Career Highlights

Mohammad Matiar Rahman Howlader is currently associated with Ayumi Industry, where he continues to work on innovative solutions in substrate bonding. His expertise and dedication to research have positioned him as a key figure in his field.

Collaborations

He has collaborated with notable professionals such as Tadatomo Suga and Tomoyuki Abe, contributing to advancements in their shared areas of expertise.

Conclusion

Mohammad Matiar Rahman Howlader's work exemplifies the spirit of innovation in substrate bonding technology. His contributions are paving the way for future advancements in this critical area of research.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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